Industrial PC

Fanless Embedded AI System with Intel® Core™ Ultra Processor, HDMI/DisplayPort, 4 LAN, 4 COM, 6 USB, 2 USB Type-C, and 9 to 60 VDC

• Intel® Core™ Ultra processor (Meteor Lake-U/H)
• Multiple compute engines: CPU, GPU (Intel® Arc GPU by H SKU) and NPU (Intel® AI Boost)
• Dual channel DDR5 5600 SO-DIMM, up to 64GB
• 6 USB and 2 USB Type-C with DisplayPort support
• Supports multiple display interfaces with 1 HDMI 1.4b and 3 x DisplayPort (2 ports via USB Type-C)
• Three 2.5GbE LAN with TSN and 1 GbE
• Two 2.5" front-access swappable HDD/SSD and 1 M.2 Key M 2280
• Wide operating temperature range from -40°C to +70°C
• Wide power input range from 9 to 60 VDC
• Supports the OpenVINO™ toolkit for AI computing

Intel® Alder Lake-N Processor Entry Performance and Compact Rugged Embedded Computer

• Onboard Intel® Alder Lake-N Processor N97 and Core™ i3-N305 Processor
• 1 x DDR5 SO-DIMM Sockets, Supports up to 4800MHz 16GB Memory
• 1x M.2 Key B Type 3052/3042 Socket for 5G Module Expansion
• 1x M.2 key B Type 2242 Socket for I/O Module Expansion
• CMI Technology for Optional I/O Module Expansions
• CFM Technology for Power Ignition Sensing Function

14/13/12th Gen Intel® Core™ Modular GPU Computer, Supports Dual Full-length GPU Expansion Up to 500W

• Intel® 14/13/12th Gen Core™ i9/i7/i5/i3 Processors (max 65 W TDP)
• 2 x DDR5 SO-DIMM Sockets, Supports ECC/non ECC type Memory, Up to 4800MHZ, 64GB
• 4x 2.5GbE LAN and optional 2x 10GbE LAN
• 1x M.2 Key E Type 2230 Socket for Wireless/Intel CNVi Module Expansion
• 1 x M.2 Key B Type 3052/3042 Socket for 5G/Storage/Add-on Card Expansion
• 1 x M.2 Key B Type 2280 Socket for Add-on Card Expansion
• 4 x 2.5" Hot Swappable SATA III HDD/SSD Bays (Max Height 15 mm) , 1x M.2 key M for NVMe SSD
• Optional CMI & CFM Modules for I/O Expansion & Power Ignition Sensing Function
• Versatile Mounting Methods (Tower Stand / Desktop / 19”Rack / Vehicle Mount)
• Wide Operating Temperature -40°C to 70°C

14/13/12th Gen Intel® Core™ Series Embedded GPU Computer, Supports 1x MXM 3.1 GPU Expansion Socket

• Intel® 14/13/12th Gen Core™ i9/i7/i5/i3 Processors (max 65 W TDP)
• Supports 1x MXM 3.1 Type A/B form factor GPU module expansion.
• 1x 2.5GbE LAN, 1x 20Gbps USB3.2 Gen2 x2, Type C Connector
• 1x M.2 Key M Type 2280 Socket for PCIe Gen4x4 NVMe Storage
• 1x M.2 Key E Type 2230 Socket for Wireless/Intel CNVi Module Expansion
• 1 x M.2 Key B Type 3052/3042 Socket for 5G/Storage/Add-on Card Expansion
• 2 x M.2 Key B Type 2242 Socket for Storage/Add-on Card Expansion
• Optional CMI & CFM Modules for I/O Expansion & Power Ignition Sensing Function
• Wide operating temperature -40°C to 70°C

Ultra-Compact DIN-Rail Fanless Embedded System with Intel® Celeron® Processor N3350, COM, 2 LAN, 4 USB, HDMI, WT

• Super compact size with fanless and cableless design
• Intel® Celeron® processor N3350, reliable F1 stepping version CPU
• COM, 4 USB, and 2 GbE LAN
• Wide operating temperature range from -40°C to +70°C
• 9 to 36 VDC wide range power input (typical: 12 to 24 VDC)
• OVP, UVP, OCP, and RPP power protection design
• AXEAPI for intelligent remote monitoring software integration

Fanless Embedded System with Intel® Alder Lake-N Processor, 2 LAN/4 LAN, HDMI, DisplayPort++, 2 COM, 4 USB, and 9 to 36 VDC

• Intel® processor N97 quad-core SoC (Alder Lake-N)
• 1 DDR4 SO-DIMM, up to 32GB
• Operating temperature ranges from -20°C to +60°C
• Supports either two or four 2.5GbE versions
• 4 USB with a power on/off feature and 2 COM
• Supports HDMI (FHD) and DisplayPort++ for dual-view
• Front-access I/O design

Intel Alder Lake-N Processor N97 Rugged Embedded Computer

• Onboard Intel ® Alder Lake-N Processor N97
• Ultra Compact Size (150 x 105 x 52.3 mm)
• 1 x DDR5 SO-DIMM Sockets, Supports Up to 4800MHZ, 16GB
• 1 x M.2 Key B Type 3052/3042 Socket for 5G/Storage/Add-on Card Expansion
• 1 x M.2 Key B Type 2242 Socket for Storage/Add-on Card Expansion
• Optional CMI modules for I/O expansion
• Wide Operating Temperature -40°C to 70°C

13/12th Gen. Intel® Core™ Series High Performance and Basic Function Rugged Embedded Computer 

• Intel® 13/12th Gen. Core™ i9/i7/i5/i3 Processors (max 65 W TDP)
• 1x M.2 Key M Type 2280 Socket for PCIe Gen 4x4 NVMe Storage
• 1x M.2 Key E Type 2230 Socket for Wireless/Intel CNVi Module Expansion
• 1x M.2 Key B Type 3052/3042 Socket for 5G/Storage/Add-on Card Expansion
• 1x M.2 Key B Type 2242 Socket for Storage/Add-on Card Expansion
• Optional CMI & CFM Modules for I/O Expansion & Power Ignition Sensing Function
• Wide operating temperature -40°C to 70°C

Fanless Embedded System with 13th Gen Intel® Core™ i7/i5/Celeron® Processor, 2 HDMI, 2 LANs, 8 USB, 2 COM, and 12 VDC

• 13th gen Intel® Core™ processor (Raptor Lake P)
• Fanless design with operating temperature from -20°C to 60°C
• 1 DDR4 SO-DIMM for up to 32GB of memory
• Intelligent power ignition management and USB power on/off control
• Supports high-speed NVMe storage (M.2 Key M 2280)
• Excellent heat-dissipation DIN-rail system
• Supports Intel® vPro and TPM 2.0

Intel® Alder Lake-N Platform, Slim Embedded Computer with CDS Technology

• Onboard Intel® Alder Lake-N Processor N97 and Atom® x7425E Processor
• 1 x DDR5 SO-DIMM Socket, Supports up to 4800MHz & 16GB Memory
• 1 x M.2 Key E Type 2230 Socket for Wireless / Intel CNVi Module Expansion
• 1 x M.2 Key B Type 3042 / 3052 Socket for 5G / Storage / Add-on Card Expansion
• Supports Cincoze Patent CDS Technology (Patent No. M482908)
• CFM Technology for Power Ignition Sensing & PoE Function
• Wide Operating Temperature -40°C to 70°C
• EMC Emission / Immunity Standard for Industrial Environment : EN61000-6-4, EN61000-6-2

Intel® 12th Gen. Alder Lake-P Platform, High Performance and Power Saving Rugged Embedded Computer

• Onboard 12th Intel® Alder Lake-P U-Series Core™ i7/i5/i3 Processors
• 1 x DDR5 SO-DIMM Sockets, Supports up to 4800MHz 32GB Memory
• Quad Independent Display (2x DP/HDMI/CMI Display)
• 1x M.2 Key E Type 2230 Socket for Wireless / Intel CNVi Module Expansion
• 1x M.2 Key B Type 3042 / 3052 Socket for 5G / Storage / Add-on Card Expansion
• CMI Technology for Optional I/O Module Expansions
• CFM Technology for Power Ignition Sensing Function & PoE
• Wide Operating Temperature -40°C to 70°C

Intel® 12th Gen. Alder Lake-P U-Series Core™ Slim Embedded Computer with CDS Technology

• Onboard Intel® Alder Lake-P U-Series Core™ Processor
• 2 x DDR5 SO-DIMM Socket, Supports up to 4800MHz 64GB Memory
• Quad Independent Display (CDS / HDMI / DP / VGA)
• 1x M.2 Key E Type 2230 Socket for Intel CNVi / Wireless Module
• Supports Cincoze Patent CDS Technology (Patent No. M482908)
• CFM Technology for Power Ignition Sensing & PoE Function
• Wide Operating Temperature -40°C to 70°C
• EMC Emission / Immunity Standard for Industrial Environment : EN61000-6-4, EN61000-6-2

Intel® 12th Gen. Alder Lake-P U-Series Core™ Slim Embedded Computer with CDS Technology

• Onboard Intel® Alder Lake-P U-Series Core™ Processor
• 2 x DDR5 SO-DIMM Socket, Supports up to 4800MHz 64GB Memory
• Quad Independent Display (CDS / HDMI / DP / VGA)
• 1x M.2 Key E Type 2230 Socket for Intel CNVi / Wireless Module
• Supports Cincoze Patent CDS Technology (Patent No. M482908)
• CFM Technology for Power Ignition Sensing & PoE Function
• Wide Operating Temperature -40°C to 70°C
• EMC Emission / Immunity Standard for Industrial Environment : EN61000-6-4, EN61000-6-2

DIN-Rail Cybersecurity Gateway with Intel Atom® x5-E3930/E3940 Processor and 4 LAN with LAN Bypass

• Cost-effective with fanless design
• Intel Atom® x5-E3930/E3940 processor (Apollo Lake)
• 4 GbE RJ-45 (Intel® I210-IT) with LAN Bypass
• Wide operating temperature range from -40°C to +70°C
• 9 to 36 VDC, typical 12-24V power input with OVP, UVP, OCP, RPP
• Supports TPM 2.0
• Ideal for ICS cybersecurity and critical infrastructure protection

Fanless Edge AI System with NVIDIA® Jetson Orin™ NX 16GB, 1 HDMI, 1 GbE PoE, 1 2.5 GbE PoE, 2 USB, 1 COM/CAN, Isolated DIO (4-in/4-out), and 4-CH GMSL for AMR & Robotics

• NVIDIA® Jetson Orin™ NX (100 TOPS)
• Seamless speed: 5G, Wi-Fi 6E, and 2.5 GbE combined
• Easily manage: USB and PoE device power control
• Supports dual PoE for camera & sensor connectivity
• -25°C to +60°C operating temperature range
• Supports 24/7 secure remote monitoring, control, and OTA deployment empowered by Allxon
• Supports NVIDIA Isaac™ Robot Operating System (ROS) SDK for AI-enabled robots development 

Edge AI Developer Kit with NVIDIA® Jetson Orin™ NX SoM, 1 HDMI, 1 GbE LAN, 1 GbE PoE, and 2 USB

• NVIDIA® Jetson Orin™ NX (up to 100 TOPS)
• 1 USB 2.0, 1 USB 3.2 Gen2, 1 GbE LAN
• Supports one 15W GbE PoE for camera
• 1 M.2 Key M NVMe SSD slot
• 1 PCI Express Mini Card slot for Wi-Fi/Bluetooth/LTE/GPS
• JetPack supported
• Supports 24/7 secure remote monitoring, control, and OTA deployment empowered by Allxon

Edge AI Developer Kit with NVIDIA® Jetson Orin™ Nano SoM, 1 HDMI, 1 GbE LAN, 1 GbE PoE, and 2 USB

• NVIDIA® Jetson Orin™ Nano (up to 40 TOPS)
• 1 USB 2.0, 1 USB 3.2 Gen2, 1 GbE LAN
• Supports one 15W GbE PoE for camera
• 1 M.2 Key M NVMe SSD slot
• 1 PCI Express Mini Card slot for Wi-Fi/Bluetooth/LTE/GPS
• JetPack supported
• Supports 24/7 secure remote monitoring, control, and OTA deployment empowered by Allxon

Compact DIN-Rail Edge Controller with 11th Gen Intel® Core™ i CPU

• Port isolation for 8 x DI, 8 x DO, 4 x COM
• Supports M.2 M key 2280 NVMe SSD storage, M.2 B key 2242 storage, 3042/3052 cellular modules, and M.2 E Key 2230 wi-fi modules
• Dual 2500BASE-T Ethernet supports Time-Sensitive Network(TSN) technology
• Remote out-of-band (OOB) power management with Advantech iBMC technology
• Microsoft Azure IoT Edge and Amazon AWS IoT Greengrass certified

Small-Size Integrated DIN-Rail IPC with Intel® Atom® x6425RE

• Intel® Atom®  x6425RE (1.9GHz) processor with 8GB DDR4 memory
• Wide operating temperature range (-40 ~ 70 °C) and wide power input range (10 ~ 36 VDC)
• Port isolation for 8 x DI, 8 x DO, 2 x COM
• DP++ ensures HDMI/DVI compatibility
• Dual storage: 1 xM.2 M-key 2242 PCIe/NVMe or SATA/SSD and 1 x mSATA
• Onboard TPM 2.0 provides hardware-based security
• Modular design for optional iDoor extension
• Ruggedized DIN-rail kit
• Compliant with IEC 61010-1 safety requirements

Intel® 2nd Gen. Xeon® D-1700 Extreme Performance Box PC with 3 Expansion Slots

• Powered by Intel® 2nd Gen. Xeon® D-1700 series processor up to 10 cores
• 4x DDR4 SO-DIMM sockets support ECC/non-ECC memory up to 128GB
• Versatile expansion options with PCI, PCIex4, PCIex16, M.2 B Key and E key
• Support PCIex16 high performance graphic card up to 350W
• 2x 10GbE port for fast data communication (optional)
• Up to 4 x 2.5" SATAIII HDD bay
• IPMI 2.0-compliant management with reliability and security enhancements

• Fanless embedded system
• Intelligent power management Ignition, USB power on/off control
• EN 61000-6-2 certified
• Optional DIN-rail, bookshelf and wall mount kits
• Optional PCIEx16 -slot

Intel Atom x6413E QC SoC with GbE, COM, USB, HDMI/DP and DIO ports DIN-Rail Fanless Box PC

• Intel Atom® x6413E Quad Core
• DIN-Rail system with essential I/O ports on front-side bezel
• 2 x Intel GbE and 2 x RS-232/422/485
• Dual independent displays with one 4K HDMI and one 4K DP
• 2 x USB 3.2 and 2 x USB 2.0, 1 x internal USB2.0 for security dongle
• 1 x M.2 2280 B key with nano SIM holder and 1 x M.2 2230 E key, 1 x full-size mPCIe
• mSATA and 1 x 2.5" SATA storage device
• 12V ~ 28V wide range power input, -40 ~ 60 °C extended operating temperature

Intel® 11th gen Core™ i processor with Triple LAN/ Quadruple COM Din-Rail Fanless Box PC

• i3-1115G4E CPU /Core i5-1145G7E
• DIN-Rail system with essential I/O ports on front-side bezel
• 3 x Intel GbE, 4x RS-232/422/485
• 3 x USB 3.2 and 3 x USB 2.0, dual independent displays with one 4K HDMI and one VGA
• 3 Expansion: M.2 E-Key 2230, M.2 B-Key 2280, 1 x Full-size mSATA share with mPCIe slot
• mSATA and 1 x 2.5" SATA storage device
• 12V ~ 24V wide range power input
• -40 ~ 60 °C extended operating temperature
• WISE-DeviceOn supported for quick AI deployment at scale

12th &13th Gen Intel® Core™ i3/i5/i7/i9 LGA1700 Expansion Fanless Box PC, PCIEx16 & 2x PCI

• Support Intel® 12th & 13th Gen. Core™ i3/i5/i7/i9 processor
• Triple independent display: HDMI + HDMI + Optional Display
• DDR5 SO-DIMM memory support up to 64 GB
• 9-36VDC wide range power input
• Up to 3sets 2.5" hard drive bays
• Support up to 4GbE, 8USB, 8COM, 16bit DIO, 2CANBus, TPM2.0
• SUSI API, WISE-DeviceOn, McAfee and Acronis bundled

12th &13th Gen Intel® Core™ i3/i5/i7/i9 LGA1700 Expansion Fanless Box PC, PCIEx16, PCIEx4

• Support Intel® 12th & 13th Gen. Core™ i3/i5/i7/i9 processor
• Triple independent display: HDMI + HDMI + Optional Display
• DDR5 SO-DIMM memory support up to 64 GB
• 9-36VDC wide range power input
• Up to 3sets 2.5" hard drive bays
• Support up to 4GbE, 8USB, 8COM, 16bit DIO, 2CANBus, TPM2.0
• SUSI API, WISE-DeviceOn, McAfee and Acronis bundled

Fanless Embedded System with LGA1700 12th Gen Intel® Core™ i7/i5/i3 or Celeron® processor, Intel® H610, 4 COM, 2 LANs, 2 HDMI, 4 USB, 8-CH DIO and 19VDC

• LGA1700 12th gen Intel® Core™ i7/i5/i3, 35W TDP
• Intel® UHD Graphics 770 by Intel® Xe Architecture with up to 32 graphics
• 8-CH DIO
• 2 HDMI for dual display outputs
• -10˚C to +50˚C wide operating temperatures
• 19VDC power input w/power protection
• Cost-effective design

12th/13th Generation Intel Core Series Processors, High Performance, Expandable and Modular Rugged Embedded Computer with 2x PCI/PCIe Expansion Slot

12th/13th Generation Intel® Core™ Series Processors, High Performance, Expandable and Modular Rugged Embedded Computer with 1x PCI/PCIe Expansion Slot

12th/13th Generation Intel® Core™ Series Processors, High Performance, Expandable and Modular Rugged Embedded Computer

Fanless Embedded System with 12th Gen Intel® Core™ i7/i5/i3 Processor for Railway

• CE, LVD, FCC, EN 50155, EN 45545-2 certified
• 12th gen Intel® Core™ i7/i5/i3 or Celeron® processor (Alder Lake-U)
• 24 to 110 VDC for Railway applications
• Value-added modules available for various I/O requirements (COM/LAN/DIO/PoE/CAN/BNC)
• Intelligent solution of power management (ACC ignition)
• 2 swappable 2.5" SATA drives

Mini PCI-e 2-port 2.5GbE isolated Ethernet board (-40℃~+85℃) / 1x Universal Bracket with 2x RJ45 Cutout

Fanless Industrial System with LGA1700 Socket 12th Gen Intel® Core™ i7/i5/i3 Processor, Intel® Q670E, and Front-access I/O

• 4 PCIe slot
• Optional extension system I/O window
• Optional 5G network (Q670E)
• USB power on/off control via BIOS setting
• Intelligent power management - ACC ignition
• EN 61000-6-2 certified
• Supports Intel® RST

Fanless Industrial System with LGA1700 Socket 12th Gen Intel® Core™ i7/i5/i3 Processor, Intel® H610E/Q670E, and Front-access I/O

• 2 PCIe slot / PCIe & PCI slot
• Optional extension system I/O window
• Optional 5G network (Q670E)
• USB power on/off control via BIOS setting
• Intelligent power management - ACC ignition
• EN 61000-6-2 certified
• Supports Intel® RST

Fanless Industrial System with LGA1700 Socket 12th Gen Intel® Core™ i7/i5/i3 or Celeron® Processor, Intel® Q670E, and Front-access I/O

• Fanless embedded system
• Optional extension system I/O window
• Optional 5G network (Q670E)
• USB power on/off control via BIOS setting
• Intelligent power management - ACC ignition
• EN 61000-6-2 certified
• Supports Intel® RST

Fanless Embedded System, Intel 11th Gen i5-1135G7 CPU, HDMI, VGA, 2x GbE LAN, 8x USB, 6xCOM, GPIO

• 11th Gen Core-i CPU, i5-11135G7 Ultra Low Voltage
• 2.5" SATA SSD / mSATA
• HDMI & VGA display
• 4x USB3.0 & 4x USB2.0
• 2x GbE LAN
• 9-36V DC input

Fanless Embedded System, Intel 11th Gen i5-1135G7 CPU, HDMI, VGA, 1x GbE LAN, 6x USB, 2xCOM

• 11th Gen Core-i CPU, i5-1135G7 Ultra Low Voltage
• 2.5" SATA SSD / mSATA
• HDMI & VGA display
• 4x USB3.0 & 2x USB2.0
• 1x 2.5GbE LAN

Fanless embedded system with LGA1700 socket 13th/12th Gen Intel® Core™ i9/i7/i5/i3 or Celeron® processor, Intel® R680E, 2 HDMI, DisplayPort, 6 USB, 4 LAN, and 9 to 36 VDC 

• 13th/12th Gen Intel® Core™ i9/i7/i5/i3 and Celeron® processors with Intel® R680E chipset (Alder Lake S)
• Dual DDR5 SO-DIMM for up to 64GB of memory
• 4 LAN with optional PoE supported
• Dual 2.5" SATA HDD drive bays with RAID 0 & 1
• Supports MXM 3.1 Type A, up to 5 display outputs
• -40 °C to +65 °C wide operating temperatures
• Wide range power input from 9 to 36 VDC
• Flexible I/O window supported via mPCIe modules

12th Gen. Intel® Core™ Series High Performance and Compact Rugged Embedded Computer

• Intel® 12th Gen Alder Lake-S Core™ i9/i7/i5/i3 Processors (max 65 W TDP)
• 2 x DDR5 SO-DIMM Sockets, Supports ECC/non ECC type Memory, Up to 4800MHZ, 64GB
• Quad Independent Display (HDMI / DP / DVI-I)
• 1x M.2 Key E Type 2230 Socket for Intel CNVi / Wireless Module
• CMI Technology for Optional I/O Module Expansions
• CFM Technology for Power Ignition Sensing & PoE Function
• Wide Operating Temperature -40°C to 70°C
• Safety Standard: CE, e-Mark, EN 62368-1

Fanless Embedded System, Intel 8/9th Gen Core i5/i7 CPU, PCIE & PCI -slot, HDMI & VGA, 5x GbE LAN (4x PoE), 9x USB, 6x COM, DIO

• High performance Intel Core i5/i7 CPU, 35W/65W
• HDMI & VGA display
• 7x USB3.0, 2x USB2.0
• 1x GbE LAN, RJ-45
• 4x GbE PoE Port LAN, RJ-45
• 2x COM RS-232
• 4x COM RS-485
• Isolated DIO (4in/4out)
• PCIEx16 -slot (x8 signal) & PCI -slot
• mPCIE -slot (4G)
• M.2 2230 Key-E for WIFI

Intel® Elkhart Lake Atom® x6000E Series Processor Slim Embedded Computer with CDS Technology

• Intel® Elkhart Lake Atom® x6425E/x6211E Processor
• 1x DDR4 SO-DIMM
• 1x M.2 Key E Type 2230 Socket for Intel® CNVi/Wireless Module
• CFM Technology for Power Ignition Sensing Function and PoE Function