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PEAK-779VL2
Tuotenro
peak-779vl2
Toimitusaika 21-30pv
PICMG1.0 Full-size SBC with Intel® B75 Support Intel® 3rd generation Core i7/i5/i3 processors
Ominaisuudet
*Scalable platform 3rd generation Intel® Core i7/i5/i3 processors + non-ECC
*Intel® B75 PCH chipset support PICMG1.0 specification
*Support Dual channel DDR3 with Non-ECC DIMMs 1333/1600MHz, up to 16GB
*Support PCI/ISA, 4 x USB3.0/4 x USB2.0, 1 x SATA3.0/3 x SATA2.0 and 2xGbE
* Display support for VGA, DVI, HDMI
*Intel® B75 PCH chipset support PICMG1.0 specification
*Support Dual channel DDR3 with Non-ECC DIMMs 1333/1600MHz, up to 16GB
*Support PCI/ISA, 4 x USB3.0/4 x USB2.0, 1 x SATA3.0/3 x SATA2.0 and 2xGbE
* Display support for VGA, DVI, HDMI
| Valmistaja / Brand | Nexcom |
|---|---|
| Socket | LGA 1155 |
| Form Factor | PICMG 1.0 |