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DV-1100
Tuotenro
DV-1100
Varastossa
0,00 EUR
13/12th Gen. Intel® Core™ Series High Performance and Basic Function Rugged Embedded Computer
- Intel® 13/12th Gen. Core™ i9/i7/i5/i3 Processors (max 65 W TDP)
- 1x M.2 Key M Type 2280 Socket for PCIe Gen 4x4 NVMe Storage
- 1x M.2 Key E Type 2230 Socket for Wireless/Intel CNVi Module Expansion
- 1x M.2 Key B Type 3052/3042 Socket for 5G/Storage/Add-on Card Expansion
- 1x M.2 Key B Type 2242 Socket for Storage/Add-on Card Expansion
- Optional CMI & CFM Modules for I/O Expansion & Power Ignition Sensing Function
- Wide operating temperature -40°C to 70°C
System | |
Processor | 13th Generation Intel® Raptor Lake-S Series CPU 12th Generation Intel® Alder Lake-S Series CPU |
Security Hardware | |
Chipset | Intel H610E Chipset |
Storage | 1x 2.5” SATA HDD/SSD Bay 1x M.2 SSD Shared by M.2 Key M Type 2280 Socket, Support PCIe Gen 4x4 NVMe SSD or SATA 3.0 SSD 2x M.2 SSD Shared by M.2 Key B Socket, Support PCIe Gen 3x2 NVMe SSD or SATA 3.0 SSD |
Audio | Realtek® ALC888, High Definition Audio |
Memory | 1x DDR5 4800MHz SO-DIMM Socket Supports Un-buffered and non-ECC Type, Up to 32GB |
Graphics | Integrated Intel® UHD Graphics
770: Core™ i9/i7/i5 Integrated Intel® UHD Graphics 730: Core™ i3 Integrated Intel® UHD Graphics 710: Pentium®/Celeron® |
I/O Ports | |
USB 2.0 | 3x USB2.0 |
USB 3.0 | 3x USB 3.2 |
Serial | 2x RS-232/422/485 |
Video | 1 x VGA 1 x DisplayPort 1x CMI Interface for Optional CMI-DP/CMI-HDMI Module Expansion |
Ethernet | 1x 2.5GbE LAN, RJ45, Intel® I225 1x 1GbE LAN, RJ45, Intel® I219 |
Other Ports | Mic-in/Line-out 1x Remote Power On/Off Connector |
Expansion | |
Expansion Interface | 1x CFM IGN Interface for optional CFM-IGN Module
Expansion 1x CMI Interface for optional CMI-Display Module Expansion 2x CMI Interface for optional CMI-COM/DIO Module Expansion 1x M.2 Key B Type 3042/3052 Socket, Support 5G/Storage/Add-on Card Expansion 1x M.2 Key B Type 2242 Socket, Support Storage/Add-on Card Expansion 1x M.2 Key E Type 2230 Socket, Support Wireless/Intel CNVi Module Expansion 1x SIM Socket |
Operating System | |
Operating System | Windows® 10 |
Power | |
DC Input / Source Voltage | Power Input Voltage 9~48VDC IGN function with optional module |
Operating Temperature | |
Operating Temperature | 35W TDP Processor: -40°C to 70°C |
Humidity Range | 10% ~ 95%, non-condensing |
Cooling System / Thermal Solution | |
Thermal Solution | Passive - Fanless |
Dimensions / Weight | |
Weight (kg) | 2.5 kg |
Dimensions | 224 x 162 x 62 mm |
Enclosure | |
Bezel | |
Material | Aluminum / Steel |
Mounting | Wall / DIN-RAIL / VESA Mount |
Peripherals & Devices | |
Accessories | Optional Modules |
Extra Features | |
Certification | |
Certification | CE, UKCA, FCC, ICES-003 Class A EN IEC 61000-6-4 / EN IEC 61000-6-2 (24VDC Input Only) EN 50155 (EN 50121-3-2 Only) E-mark (Pending) |
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Jäähdytys | Fanless |
---|---|
CPU Family | Alder Lake (12th Gen Core i3/i5i7/i9) |
Operating Temp | Wide Temp -40..70C |
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