Rugged Compact

Intel Alder Lake-N Processor N97 Rugged Embedded Computer

• Onboard Intel ® Alder Lake-N Processor N97
• Ultra Compact Size (150 x 105 x 52.3 mm)
• 1 x DDR5 SO-DIMM Sockets, Supports Up to 4800MHZ, 16GB
• 1 x M.2 Key B Type 3052/3042 Socket for 5G/Storage/Add-on Card Expansion
• 1 x M.2 Key B Type 2242 Socket for Storage/Add-on Card Expansion
• Optional CMI modules for I/O expansion
• Wide Operating Temperature -40°C to 70°C

Intel® 12th Gen. Alder Lake-P Platform, High Performance and Power Saving Rugged Embedded Computer

• Onboard 12th Intel® Alder Lake-P U-Series Core™ i7/i5/i3 Processors
• 1 x DDR5 SO-DIMM Sockets, Supports up to 4800MHz 32GB Memory
• Quad Independent Display (2x DP/HDMI/CMI Display)
• 1x M.2 Key E Type 2230 Socket for Wireless / Intel CNVi Module Expansion
• 1x M.2 Key B Type 3042 / 3052 Socket for 5G / Storage / Add-on Card Expansion
• CMI Technology for Optional I/O Module Expansions
• CFM Technology for Power Ignition Sensing Function & PoE
• Wide Operating Temperature -40°C to 70°C

Compact, High Performance, Modular Embedded Computer with 8th Gen Intel® Core™ U CPU

• Embedded 8th Gen Intel® Core™ U i7/i5/i3 CPU (TDP 15W)
• 1x 2.5" front-accessible SATA HDD bay for quick access and 1x mSATA socket
• 2x full-size Mini PCIe sockets for module expansion
• 2x front-accessible SIM card slots for signal redundancy
• Optional CMI modules (2x 10 GbE LAN, M12 A-coded, or M12 X-coded)
• Optional CFM modules (power ignition sensing, or 4x PoE)
• Wide operating temperature -40°C to 70°C
• MIL-STD-810G, E-mark, and EN50155 (EN 50121-3-2 only) certified

• Onboard 6th Generation Intel® Core™ Mobile Processor (BGA Type)
• 1x DDR4 SO-DIMM Socket, 2133MHz, Supports Up to 32 GB
• Triple Independent Display (DVI-I, DisplayPort)
• Compact Size 203 x 142 x 66.8 mm with Light Weight 1.65 kg
• 1x Hot-swappable 2.5” SATA HDD/SSD Bay and 1x Internal 2.5” SATA HDD/SSD Bay, Supports RAID 0/1
• Rich I/O Including DVI, DP, 2x GbE LAN, 6x COM, 6x USB, 8x Optical Isolated DIO
• Supports Cincoze CMI Technology for LAN, PoE & M12 Connector Expansion
• Supports Cincoze CFM Technology for Power Ignition Sensing (IGN) Function Expansion
• Cincoze MEC Module Kits for Various I/O Expansion
• 2x Full-size Mini-PCIe Slots for Wireless and I/O Expansion
• Wide Operating Temperature (-40°C to 70°C)
• EN50121-3-2 Certified for Railway Application
• E-Mark (E13, No. 10R-0514273) Certified for In-vehicle Application

• Onboard Intel® Pentium® N4200 Processor
• Supports Triple Independent Display
• Supports CMI Interface for I/O Expandability
• Supports PoE+ and Power Ignition Function (with optional CFM modules)
• 1x 2.5” SATA Drive Bay, 1x mSATA Socket
• 2x Full Size Mini-PCIe Socket, 2x SIM Card Socket
• Compact Size (185 x 131 x 56.5 mm)
• Wide Operating Temperature -40°C to 70°C
• E-Mark (E13, No. 10R-0515075), LVD EN60950-1

• Onboard Intel® Celeron® N3350 Processor
• Supports Triple Independent Display
• Supports PoE+ Function (with optional CFM module)
• Supports CMI Interface for I/O Expandability
• 1x 2.5” SATA Drive Bay, 1x mSATA Socket
• 2x Full Size Mini-PCIe Socket, 1x SIM Card Socket
• Ultra Compact Size (150 x 105 x 52.3 mm)
• Wide Operating Temperature -40°C to 70°C
• Safety: LVD EN62368-1

• Onboard Intel® Atom™ E3845 Processor Quad Core, 1.91GHz
• 1x DDR3L SO-DIMM Max. up to 8 GB
• Dual Independent Display from 1x DVI-I and 1x DisplayPort
• 2x Intel® GbE port support Wake-on-LAN and PXE
• 1x USB 3.0, 3x USB 2.0
• 4x RS232/422/485 port with 5V/12V power
• 4x Isolated DI, 4x Isolated DO
• 1x 2.5” SATA SSD/HDD bay
• 1x CFast card and 1x SIM card socket
• 9~48VDC power input, support AT/ATX mode
• 2x Mini-PCIe slot for Wi-Fi / GSM / I/O expansion
• Universal I/O bracket for Mini-PCIe expansion
• E-Mark (E13, No.10R-0514062) Certified