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IPC962-525
SKU
IPC962-525-N-DC-Q370
Lead time 21-30 days
0.00EUR
2-slot Industrial System with LGA1151 Socket 8th/9th Gen Intel® Core™ i7/i5/i3 Processor, Intel® Q370, Front-access I/O, PCIe and PCI Slots
- LGA1151 Socket 9th/8th gen Intel® Core™ processor, up to 65W
- Supports RAID 0,1 (Intel® Q370)
- Supports Power-on delay function
- Supports TPM 2.0
- Supports AMT 12 (Intel® Q370)
System | |
Processor | 9th/8th gen Intel® Core™ processor, up to 65W |
CPU Performance | - Core™ i7-8700/T - Core™ i5-8500/T - Core™ i3-8100/T |
Security Hardware | |
Chipset | Intel® Q370 |
Storage | 2 x 2.5” SATA HDD/SSD Bay |
Storage Support | |
Memory | 2 x DDR4 SO-DIMM Non-ECC slot, up to 64GB |
Graphics | |
I/O Ports | |
USB 2.0 | 2 x USB2.0 |
USB 3.0 | 4x USB 3.1 Gen2 |
Serial | 1 x RS-232/422/485 (default RS-232) |
Video | 1 x HDMI 1 x VGA |
Ethernet | 2 x 10/100/1000 Mbps(Intel® i211-AT & i219-LM) |
Other Ports | 1 x Line-out 1 x Switch for power On/Off (ATX) 1 x Remote switch 1 x 4-pin terminal block 1 x AT/ATX selectable switch |
Expansion | |
Expansion Interface | 2 x slot expansion 1 x mPCIe slot (USB&pcie signal) 1 x I/O module slot |
Operating System | |
Operating System | Windows® 10 |
Power | |
DC Input / Source Voltage | Power Input Voltage 24VDC |
Operating Temperature | |
Operating Temperature | -10°C ~ +60°C with W.T. SSD |
Humidity Range | 10% ~ 95%, non-condensing |
Cooling System / Thermal Solution | |
Thermal Solution | Passive - Fanless |
Dimensions / Weight | |
Weight (kg) | 4.40 kg |
Dimensions | 147.5 x 192 x 230 mm |
Enclosure | |
Bezel | |
Material | Aluminum / Steel |
Mounting | Desk / Wall mounting |
Peripherals & Devices | |
Accessories | Optional Modules |
Extra Features | |
Certification | |
Certification | CE, FCC certified |
Cooling | Fanless |
---|---|
CPU Family | Coffee Lake Refresh (9th Gen Core i3/i5/i7) |
Operating Temp | Normal Temp 0..70C |