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IPC960-525-FL
SKU
IPC960-525-N-DC-FL-Q370
Lead time 21-30 days
0.00EUR
- LGA1151 Socket 9th/8th gen Intel® Core™ processor, up to 65W
- Supports RAID 0,1 (Intel® Q370)
- Supports Power-on delay function
- Supports TPM 2.0
- Supports AMT 12 (Intel® Q370)
| System | |
| Processor | 9th/8th gen Intel® Core™ processor, up to 65W |
| CPU Performance | - Core™ i7-8700/T - Core™ i5-8500/T - Core™ i3-8100/T |
| Security Hardware | |
| Chipset | Intel® Q370 |
| Storage | 2 x 2.5” SATA HDD/SSD Bay |
| Storage Support | |
| Memory | 2 x DDR4 SO-DIMM Non-ECC slot, up to 64GB |
| Graphics | |
| I/O Ports | |
| USB 2.0 | 2 x USB2.0 |
| USB 3.0 | 4x USB 3.1 Gen2 |
| Serial | 1 x RS-232/422/485 (default RS-232) |
| Video | 1 x HDMI 1 x VGA |
| Ethernet | 2 x 10/100/1000 Mbps(Intel® i211-AT & i219-LM) |
| Other Ports | 1 x Line-out 1 x Switch for power On/Off (ATX) 1 x Remote switch 1 x 4-pin terminal block 1 x AT/ATX selectable switch |
| Expansion | |
| Expansion Interface | 1 x mPCIe slot (USB&pcie signal) 1 x I/O module slot |
| Operating System | |
| Operating System | Windows® 10 |
| Power | |
| DC Input / Source Voltage | Power Input Voltage 24VDC |
| Operating Temperature | |
| Operating Temperature | -10°C ~ +60°C with W.T. SSD |
| Humidity Range | 10% ~ 95%, non-condensing |
| Cooling System / Thermal Solution | |
| Thermal Solution | Passive - Fanless |
| Dimensions / Weight | |
| Weight (kg) | 4.0 kg |
| Dimensions | 83.5 x 192 x 230 mm |
| Enclosure | |
| Bezel | |
| Material | Aluminum / Steel |
| Mounting | Desk / Wall mounting |
| Peripherals & Devices | |
| Accessories | Optional Modules |
| Extra Features | |
| Certification | |
| Certification | CE, FCC certified |
| Cooling | Fanless |
|---|---|
| CPU Family | Coffee Lake Refresh (9th Gen Core i3/i5/i7) |
| Operating Temp | Normal Temp 0..70C |