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IPC960A-Q
SKU
IPC960A-Q
Lead time 14-22 days
0.00EUR
Fanless Industrial System with LGA1700 Socket 12th Gen Intel® Core™ i7/i5/i3 or Celeron® Processor, Intel® Q670E, and Front-access I/O
- Fanless embedded system
- Optional extension system I/O window
- Optional 5G network (Q670E)
- USB power on/off control via BIOS setting
- Intelligent power management - ACC ignition
- EN 61000-6-2 certified
- Supports Intel® RST
| System | |
| Processor | 12th gen Intel® Core™ processor, up to 65W |
| CPU Performance | |
| Security Hardware | TPM2.0 |
| Chipset | Intel® Q670E |
| Storage | 2 x 2.5" HDD/SSD with Intel® RST supported (7/9.5/15 mm height) 1 x M.2 Key M 2280 socket (PCIe x4 Gen4) |
| Memory | 2 x DDR5 4800/4000 SO-DIMM, up to 64GB |
| Graphics | |
| I/O Ports | |
| USB 2.0 | 1 x USB 2.0 (Q670E, internal,up to 30mm) 180D type A |
| USB 3.2 | 6 x USB 3.2 Gen2x1 (10G) type A |
| Serial | 1 x RS-232/422/485 (default RS-232) More COM ports available from extension I/O modules |
| Video | 1 x DisplayPort++ with 4096 x 2304 resolution supported 1 x HDMI with 4096 x 2304 resolution supported 1 x DVI-D with 1920 x 1200 resolution supported |
| Ethernet | 1 x 2.5GbE LAN (Intel® I226-LM) 1 x RJ-45 GbE LAN (Intel® I219-LM) with Intel® AMT More LAN ports available from extension I/O modules |
| Other Ports | 1 x Switch for power On/Off (ATX) 1 x Remote switch 1 x 3-pin terminal block 1 x AT/ATX selectable switch |
| Expansion | |
| Expansion Interface | 1 x Full-size PCI Express Mini Card slot with SIM slot (USB & PCIe interface) 1 x M.2 Key E 2230 socket 1 x M.2 Key B 3042/3050 socket with SIM slot |
| Operating System | |
| Operating System | Windows® 10, Linux |
| Power | |
| DC Input / Source Voltage | Input: 18 to 36 VDC 1 x Switch for power on/off with LED (default ATX) 1 x 4-pin terminal block (5.08 mm) for DC input 1 x 4-pin terminal block (5.08 mm) for ignition control, remote power and remote LED |
| Operating Temperature | |
| Operating Temperature | -20°C ~ +70°C with W.T. SSD |
| Humidity Range | 10% ~ 90%, non-condensing |
| Cooling System / Thermal Solution | |
| Thermal Solution | Passive - Fanless |
| Dimensions / Weight | |
| Weight (kg) | 4.5 kg |
| Dimensions | 84 x 192 x 260 mm |
| Enclosure | |
| Bezel | |
| Material | Aluminum / Steel |
| Mounting | Desk / Wall mounting |
| Peripherals & Devices | |
| Accessories | Optional Modules |
| Extra Features | |
| Certification | |
| Certification | CE (EN 61000-6-4/EN 61000-6-2)/FCC |
| Cooling | Fanless |
|---|---|
| CPU Family | Alder Lake (12th Gen Core i3/i5i7/i9) |
| Operating Temp | Wide Temp -20..70C |