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eBOX671B-ALD-GbE

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eBOX671B-ALD-GbE

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 eBOX671B-ALD-GbE
eBOX671B-ALD-GbE

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Summary
    SKU
    eBOX671B-ALD-GbE
    Lead time 21-30 days

    0.00EUR

    Fanless embedded system with LGA1700 socket 13th/12th Gen Intel® Core™ i9/i7/i5/i3 or Celeron® processor, Intel® R680E, 2 HDMI, DisplayPort, 6 USB, 4 LAN, and 9 to 36 VDC 

    • 13th/12th Gen Intel® Core™ i9/i7/i5/i3 and Celeron® processors with Intel® R680E chipset (Alder Lake S)
    • Dual DDR5 SO-DIMM for up to 64GB of memory
    • 4 LAN with optional PoE supported
    • Dual 2.5" SATA HDD drive bays with RAID 0 & 1
    • Supports MXM 3.1 Type A, up to 5 display outputs
    • -40 °C to +65 °C wide operating temperatures
    • Wide range power input from 9 to 36 VDC
    • Flexible I/O window supported via mPCIe modules
    System
    Processor LGA1700 socket 13th/12th Gen Intel® Core™ i9/i7/i5/i3 & Celeron® processor (35W/65W)
    CPU Performance
    Security Hardware TPM 2.0
    Chipset Intel® R680E
    Storage 2 x 2.5” SATA HDD/SSD (up to 9.5 mm height)
    2 x mSATA (enabled in jumper setting)
    Storage Support
    Memory 2 x 262-pin DDR5-4800 SO-DIMM, up to 64GB
    Graphics Integrated Intel® HD Graphics
    I/O Ports
    USB 2.0 -
    USB 3.0 2 x USB 3.2 Gen1
    4 x USB 3.2 Gen2
    Serial 2 x RS-232
    2 x RS-232/422/485
    Video 2 x HDMI 1.4b (lockable)
    1 x DisplayPort 1.4 ++
    Ethernet 3 x 2.5 GbE (Intel® i226-IT)
    1 x GbE LAN (Intel® i219-LM)
    Other Ports 1 x Audio
    1 x Power button
    1 x Remote switch
    1 x Front access SIM slot with cover (for M.2 Key B)
    1 x Reset switch connector
    5 x Antenna opening
    Expansion
    Expansion Interface 1 x Full-size PCI Express Mini Card slot (USB 2.0 + PCIe + SIM + mSATA signal)
    1 x M.2 Key M 2280 socket (for storage)
    1 x M.2 Key E 2230 socket (for Wi-Fi 6E)
    1 x M.2 Key B 3052 socket (for 5G)
    1 x Internal SIM slot for PCIe Mini Card slot
    1 x MXM3.1 type A connector
    1 x Flexible IO window (Default: 2 x DB9 half-cut bracket)
    Operating System
    Operating System Win 10 IoT, Win 11 IoT, Linux
    Power
    DC Input / Source Voltage 9 to 36 VDC with ACC ignition
    Operating Temperature
    Operating Temperature Without MXM module:
    -40°C to +65°C (with W.T. DRAM & SSD, CPU TDP 35W)
    -40°C to +55°C (with W.T. DRAM & SSD, CPU TDP 65W)

    With MXM module:
    -40°C to +55°C (with W.T. DRAM & SSD & MXM kit, CPU TDP 35W)
    Humidity Range 10% ~ 90%, non-condensing
    Cooling System / Thermal Solution
    Thermal Solution Passive – Fanless (Fan available)
    Dimensions / Weight
    Weight (kg) 4.9 kg
    Dimensions 280 x 210 x 80.5 mm
    Enclosure
    Bezel
    Material Aluminum / Steel
    Mounting Desk / Wall mounting kit / DIN-rail kit
    Peripherals & Devices
    Accessories Optional Modules
    Extra Features
    Certification
    Certification CE, FCC Class A
    More Information
    CoolingFanless
    CPU FamilyAlder Lake (12th Gen Core i3/i5i7/i9)