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DI-1100
SKU
DI-1100
Lead time 21-30 days
0.00EUR
Compact, High Performance, Modular Embedded Computer with 8th Gen Intel® Core™ U CPU
- Embedded 8th Gen Intel® Core™ U i7/i5/i3 CPU (TDP 15W)
- 1x 2.5" front-accessible SATA HDD bay for quick access and 1x mSATA socket
- 2x full-size Mini PCIe sockets for module expansion
- 2x front-accessible SIM card slots for signal redundancy
- Optional CMI modules (2x 10 GbE LAN, M12 A-coded, or M12 X-coded)
- Optional CFM modules (power ignition sensing, or 4x PoE)
- Wide operating temperature -40°C to 70°C
- MIL-STD-810G, E-mark, and EN50155 (EN 50121-3-2 only) certified
System | |
Processor | Onboard 8th Intel® Core™ U Processors (Whiskey Lake) • Intel® Core™ i7-8665UE Quad Core Processor (8M Cache, up to 4.4 GHz, 15W) • Intel® Core™ i5-8365UE Quad Core Processor (6M Cache, up to 4.10 GHz, 15W) • Intel® Core™ i3-8145UE Dual Core Processor (4M Cache, up to 3.90 GHz, 15W) |
Security Hardware | |
Chipset | SoC |
Storage | 1x 2.5” SATA HDD/SSD Bay 1x mSATA Socket (shared by Mini-PCIe socket) Support RAID 0/1 |
Memory | 1x DDR4 SO-DIMM Socket, Support Up to 2400MHz 32 GB |
Graphics | Integrated Intel® UHD Graphics 620 |
I/O Ports | |
USB 2.0 | 2 x USB2.0 |
USB 3.2 | 2x USB 3.2 (10Gbps) 2x USB 3.2 (5Gbps) |
Serial | 2x RS-232/422/485 |
Video | 1 x DisplayPort 1 x HDMI 1 x VGA |
Ethernet | 2x GbE LAN , RJ-45 |
Other Ports | Mic-in/Line-out 1x PS2 keyboard/mouse 1x Remote Power On/Off Connector |
Expansion | |
Expansion Interface | 1x High Speed CMI Interface for optional CMI Module
Expansion 1x Low Speed CMI Interface for optional CMI Module Expansion 2x Full-size Mini-PCIe Sockets 2x SIM Socket |
Operating System | |
Operating System | Windows® 10, Linux |
Power | |
DC Input / Source Voltage | Power Input Voltage 9~48VDC |
Operating Temperature | |
Operating Temperature | -40°C ~ +70°C with W.T. SSD, 15W TDP CPU |
Humidity Range | 10% ~ 95%, non-condensing |
Cooling System / Thermal Solution | |
Thermal Solution | Passive - Fanless |
Dimensions / Weight | |
Weight (kg) | 1.7 kg |
Dimensions | 203 x 142 x 66.8 mm |
Enclosure | |
Bezel | |
Material | Aluminum / Steel |
Mounting | Desk / Wall mounting/ DIN-Rail / VESA |
Peripherals & Devices | |
Accessories | Optional Modules |
Extra Features | |
Certification | |
Certification | CE, FCC, ICES-003 Class A, EN50121-3-2 (Railway), E-mark |
Cooling | Fanless |
---|---|
CPU Family | Whiskey Lake (8th Gen Core i3/i5/7) Mobile |
Operating Temp | Wide Temp -40..70C |