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DI-1000-i3

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DI-1000-i3

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DI-1000-i3
DI-1000-i3

0.00EUR

Summary
    SKU
    DI-1000-i3
    Lead time 21-30 days

    0.00EUR

    • Onboard 6th Generation Intel® Core™ Mobile Processor (BGA Type)
    • 1x DDR4 SO-DIMM Socket, 2133MHz, Supports Up to 32 GB
    • Triple Independent Display (DVI-I, DisplayPort)
    • Compact Size 203 x 142 x 66.8 mm with Light Weight 1.65 kg
    • 1x Hot-swappable 2.5” SATA HDD/SSD Bay and 1x Internal 2.5” SATA HDD/SSD Bay, Supports RAID 0/1
    • Rich I/O Including DVI, DP, 2x GbE LAN, 6x COM, 6x USB, 8x Optical Isolated DIO
    • Supports Cincoze CMI Technology for LAN, PoE & M12 Connector Expansion
    • Supports Cincoze CFM Technology for Power Ignition Sensing (IGN) Function Expansion
    • Cincoze MEC Module Kits for Various I/O Expansion
    • 2x Full-size Mini-PCIe Slots for Wireless and I/O Expansion
    • Wide Operating Temperature (-40°C to 70°C)
    • EN50121-3-2 Certified for Railway Application
    • E-Mark (E13, No. 10R-0514273) Certified for In-vehicle Application
    System
    Processor Onboard Intel® Core™ i3-6100U Processor
    CPU Performance
    Security Hardware
    Chipset SoC
    Storage 2x 2.5” SATA HDD/SSD Bay
    2x mSATA Socket (shared by Mini-PCIe socket)

    Support RAID 0/1
    Storage Support
    Memory 1x DDR4 SO-DIMM Socket, Support Up to 32GB
    Graphics Integrated Intel® HD Graphics
    I/O Ports
    USB 2.0 2 x USB2.0
    USB 3.0 4x USB 3.0
    Serial 6x RS-232/422/485
    Video 1 x DVI-I
    1 x DisplayPort
    Ethernet 2x GbE LAN , RJ-45
    Other Ports 8x Optical Isolated DIO
    Mic-in/Line-out
    1x PS2 keyboard/mouse
    1x Remote Power On/Off Connector
    Expansion
    Expansion Interface 1x CFM Interface (Control Function Module)
    1x CMI (Combined Multiple I/O) High Speed Interface
    2x Full-size Mini-PCIe Sockets
    1x SIM Socket
    Operating System
    Operating System Windows® 7 / 10
    Power
    DC Input / Source Voltage Power Input Voltage 9~48VDC
    Operating Temperature
    Operating Temperature -40°C ~ +70°C with W.T. SSD, 15W TDP CPU
    Humidity Range 10% ~ 95%, non-condensing
    Cooling System / Thermal Solution
    Thermal Solution Passive - Fanless
    Dimensions / Weight
    Weight (kg) 1.7 kg
    Dimensions 203 x 142 x 67 mm
    Enclosure
    Bezel
    Material Aluminum / Steel
    Mounting Desk / Wall mounting
    Peripherals & Devices
    Accessories Optional Modules
    Extra Features
    Certification
    Certification CE, FCC Class A, EN50121-3-2, E-Mark
    More Information
    CoolingFanless
    CPU FamilySkylake (6th Gen Core i3/i5i7)
    Operating TempWide Temp -40..70C